Customers Capitalize on AMCC's 0.13-Micron
CMOS Leadership;
UMC's 0.13-Micron Process Delivers on Promise of High Performance,
High Integration and Low Power Advantages
Availability of optimized
0.13-micron CMOS optical networking silicon further underscores
the continued success of AMCC's advanced technology strategy
SAN DIEGO and SUNNYVALE,
Calif., May 21, 2002 - With several Applied Micro Circuits
Corp. (AMCC) [NASDAQ:AMCC] 0.13-micron CMOS devices already sampling,
the highly coordinated effort between the company and UMC (NYSE:
UMC), a world-leading semiconductor foundry, continues to deliver
well-timed, "no compromise" solutions for the emerging
intelligent optical network. Among the high-performance, low-power
silicon being manufactured in volume quantities using UMC's leading-edge
0.13-micron process technology with 8 copper metal layers and true
low-k (k=2.7) dielectrics are the nPX8005, a switch fabric announced
last quarter that is optimized for Metro Access and Metro Core switching
applications, and the S3485, the industry's lowest power OC-48 transceiver.
"UMC has delivered on the promise of 0.13-micron
CMOS process technology - to provide low power, high integration
with a focus on total cost optimization at very high performance
levels," said Brent Little, senior vice president of marketing
for AMCC. "By harnessing the most advanced semiconductor technologies
available, such as the full-featured mixed-signal capabilities,
copper, and low-K dielectric of UMC's 0.13-micron process, AMCC
will continue to maximize semiconductor value for our customers
in the high-bandwidth communications space with world-class silicon
solutions. The availability of several CMOS silicon solutions further
demonstrates UMC's leadership in the 0.13-micron CMOS process technology
movement, and its commitment to AMCC as a highly strategic customer."
Fu Tai Liou, chief officer of worldwide sales
and marketing for UMC said, "AMCC is a leader in the high-bandwidth
optical networking sector, and we are delighted to be able to provide
our foundry services to help the company achieve the outstanding
chip performance exhibited by devices such as its nPX8005 crossbar
switch fabric. We currently offer the foundry industry's only 8-layer
copper and true low-k dielectric 0.13-micron process, and AMCC has
successfully leveraged this technology with its design expertise
to create the industry's most advanced optical networking ICs."
About AMCC
AMCC designs, develops, manufactures, and markets high-performance,
high-bandwidth silicon solutions empowering intelligent optical
networks. AMCC utilizes a combination of digital, mixed-signal and
high-frequency analog design expertise coupled with system-level
knowledge and multiple silicon process technologies to offer integrated
circuit products that enable the transport of voice and data over
fiber optic networks. The company's system solution portfolio includes
switch fabric, traffic management, network processor, framer/mapper,
PHY and PMD devices that address the high-performance needs of the
evolving intelligent optical network. AMCC's corporate headquarters
and wafer fabrication facilities are located in San Diego, California.
Sales and engineering offices are located throughout the world.
For further information regarding AMCC, please visit our Web site
at http://www.amcc.com.
AMCC Forward Looking
Statements
The statements contained in this press release that are not purely
historical are forward-looking statements within the meaning of Section
27A of the Securities Act of 1933 and Section 21E of the Securities
Exchange Act of 1934. Such forward-looking statements, including statements
relating to AMCC's products or UMC's process technologies, the relationship
with UMC, and anticipated sales resulting from the relationship, are
subject to a number of risks and uncertainties, including the risk
that the relationship would not result in expected sales, that the
products or process technologies would not be successfully or timely
developed or achieve market acceptance, as well as the risks relating
to general economic conditions as well as the risks and uncertainties
set forth in the Company's Annual Report on Form 10-K, and in other
filings of the Company with the Securities and Exchange Commission.
As a result of these risks and uncertainties, actual results may differ
materially from these forward-looking statements. The forward-looking
statements contained in this news release are made as of the date
hereof and AMCC does not assume any obligation to update any forward-looking
statement.
Note From UMC Concerning
Forward-Looking Statements
Some of the statements in the foregoing announcement are forward
looking within the meaning of the U.S. Federal Securities laws,
including statements about future outsourcing, wafer capacity, technologies,
business relationships and market conditions. Investors are cautioned
that actual events and results could differ materially from these
statements as a result of a variety of factors, including conditions
in the overall semiconductor market and economy; acceptance and
demand for products from UMC; and technological and development
risks.
###
AMCC is a registered trademark of Applied Micro
Circuits Corporation. All other trademarks and registered trademarks
are the property of their respective owners.
Contacts:
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UMC Contact in
the USA:
KJ Communications
Eileen Elam
(650) -917-1488
kjcome@cs.com
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Company Contact:
Applied Micro Circuits Corporation (AMCC)
Karen Hartz or Mary Pund
(858) 535-3436 or -6523
E-mail: khartz@amcc.com
mpund@amcc.com
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UMC
Contact in Taiwan:
Alex Hinnawi
(886) -2-2700-6999 ext. 6958
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AMCC Editorial
Contact:
The Ardell Group
Angela Edgerton or Karina Shaver
(858) 792-2941 or -4115
E-mail: angela@ardellgroup.com
karina@ardellgroup.com
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