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UMC is a leading foundry provider of 45/40nm
technology, having delivered customer products on this advanced
process node since 2008. UMC's 40nm process offering includes
both Low Power (LP) and high performance (40G) platforms to
meet various design application needs. The 40nm logic process
utilizes state-of-the-art immersion lithography, various mobility
enhancement techniques, ultra shallow junction and ultra low-k
dielectric for maximum power and performance optimization.
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Key
Features of UMC 40-nanometer technology
- Integrated Flows for Logic, Mixed Mode, and RF
- 193nm Immersion Litho for Critical Layers
- Strain Technology to Enhance Mobility
- Millisecond anneal for ultra shallow junction
- Retrograde Twin Well (Deep N-Well Option)
- Multiple Vt Options
- Enhanced Nitrided Gate Oxide
- NiSi Process
- 1P11M Cu/Low K (k = 2.5)
- 6T/8T e-SRAM Bit Cells
- e-Fuse Option
- Wire Bond/ Flip Chip Options
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40nm SoC Solutions
UMC's 40-nanometer SoC solution begins with a flexible technology
design platform. Customers are able to choose the process device
options that are optimized for their specific application, such
as high performance and low power transistors. Technology options
can then be implemented including mixed signal/RFCMOS and embedded
memories to further customize the process. |
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40nm
Logic/MM Devices
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