|
UMC
has been in volume production for our 0.25um process since
Q4 1997. This mainstream process is supported by an extensive
range of IP/Libraries,
and features a maximum of 5 metal layers.
UMC offers mature process technologies ranging from 0.25um
to 0.35 and 0.5um CMOS technologies. Many niche processes
are also available for these process generations including
High Voltage (HV), CMOS Image Sensor (CIS), and BiCMOS.
Process
Feature
| |
0.25um
|
0.35um
|
0.5um
|
| Vcc |
2.5/3.3V, 2.5/5V
|
3.3V/5V
|
5V
|
| Poly/Metal
layer |
1P5M
|
1P5M
|
1P3M
|
| Substrate/Well |
P-sub, Twin Well
|
P-sub, Twin Well
|
P-sub, Twin Well
|
| Isolation |
Shallow Trend Isolation
|
LOCOS
|
LOCOS
|
| Gate
Oxide |
50/65/120
|
65/120
|
135
|
| Salicide |
Titanium salicide
|
Titanium salicide
|
Titanium salicide
|
|
Backend
|
ILD |
PSG+CMP
|
USG/BPSG+Etch-back
|
USG/BPTEOS+Etch-back
|
| IMD |
HDP+PeOX+CMP
|
SRO+SOG+PEOX+CMP
|
SRO+SOG+E.B.+PEOX
|
| Intercont. |
W-plug/AI
|
W-plug/AI
|
W-plug/AI
|
| Capactitance |
Metal-insulator-Metal
|
Poly-insulator-Poly
|
Poly-insulator-Poly
|
| Mass
production |
1998 at 8" Fab
|
1996 at 8" Fab
|
1995 at 8" Fab
|
All processes of 0.25um and above have passed HCI, TDDB and
EM qualification.
Niche Process
Diverse niche processes for 0.25um and above generations are
available.
|
Process Branch
|
0.25um
|
0.35um
|
0.5um
|
|
Logic/MM
|
|
|
|
|
RF
|
|
|
|
|
HV
|
|
|
|
|
Flash
|
|
|
|
|
e-Flash
|
|
|
|
|
OTP
|
|
|
|
|
E2PRM
|
|
|
|
|
Mask ROM
|
|
|
|
|
CIS
|
|
|
|
|
u-display
|
|
|
|
|
BiCMOS
|
|
|
|
|
Power
|
|
|
|
For more information regarding the technologies, please contact
your account manager.
|
|
|
