0.18um

UMC's 0.18um technology is developed for a broad range of today's advanced applications. We offer a total solution for today's SoC designers, including IP/Libraries and SRAM compilers. In 2000, UMC led all foundries for 0.18um wafer production and deliveries, with industry leading defect density and cycle times. Copper interconnects are available for the top two metal layers. Our proven track record with advanced technologies such as 0.18um directly translates into better value, higher quality, and faster time to market for our customers.

- Proven ARM cores available, licensed on a special per-use foundry basis
- Library allows up to >100,000 logic gates per mm
- Currently in volume production for multiple market segments

Technology Key Features

• Shallow trench isolation
• Retrograde twin well (Triple well option)
  
• Dual gate oxides
• Dual poly gate with CoSi₂
• CoSi₂ S/D
• Up to 1P6M Al with FSG dielectric (top 2 layer Cu option)
  
• 4.0 SRAM bit cell
• Wirebond / Flipchip packaging