Fast Yield Ramp/Package Solution

UMC provides Product Yield Management Service to help customers' product achieve fast yield ramp. The service spans from process development through product ramp for manufacturing, as shown in the diagram below. This effort begins with the development of UMC's advanced technologies with a Yield Enhancement Vehicle (YEV) and the use of DFM solutions. Product support including tape-out review help customers identify and address potential issues quickly. In addition, UMC's fast yield feedback system and FA capability can accelerate product qualification and pilot run success. Together with an integrated wafer sort service, customers can attain production ramp for stable manufacturing with confidence.

Furthermore, UMC also offers verified package solutions, with an emphasis on solution development. With the advent of low-k dielectric and advanced backend structures such as BOAC, UMC's development methodology is critical to ensure compatibility between silicon and package material.