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UMC's testing services incorporate the latest software and
hardware solutions to provide efficient, streamlined testing.
Full service testing areas are located within all of UMC's
200mm and 300mm facilities. Customers can monitor test and
probing progress via the MyUMC online customer web portal.
Furthermore, UMC also offers verified package solutions,
with an emphasis on solution development. With the advent
of low-k dielectric and advanced backend structures such as
BOAC, UMC's development methodology is critical to ensure
compatibility between silicon and package material.
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Test
Program Development
UMC has extensive experience in test
program development for customer products, so that we may
help customers reduce test cost & find optimized test
solutions. Once customers provide the necessary data such
as product specs, pad information, simulation pattern and
test plan, UMC can perform the coding & make the probe
card within 2 weeks. First silicon verification & program
debugging will be finished 10 days following that.
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Test
Program Conversion
Cost efficiency and test service flexibility is enhanced through
UMC's test program conversion services.
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Test
Efficiency Excellence
UMC is capable of providing a wide range of test solutions.
Our backend engineering teams are experienced in various
product applications covering computing components, wired
/ wireless communication, memory and digital consumer
products.
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Multi-DUT
Test Implementation |
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Initiate Multi-DUT P/C Solutions |
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Throughput Enhancement |
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Platform
Conversion |
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Productivity Effectiveness |
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Test
Flow Optimization |
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Test
Time & Test Flow Analysis |
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Flexible
& Dynamic Production Flow |
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